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1

The origin of phase separation in silicate melts and glasses

V. McGahay, M. Tomozawa

Journal:

Journal of Non-Crystalline Solids

Year:

1989

Language:

english

File:

PDF, 545 KB

english, 1989

2

Mechanism of the mixed alkali effect based upon the thermodynamic state of glass

M. Tomozawa, V. McGahay

Journal:

Journal of Non-Crystalline Solids

Year:

1991

Language:

english

File:

PDF, 648 KB

english, 1991

3

45-nm silicon-on-insulator CMOS technology integrating embedded DRAM for high-performance server and ASIC applications

Iyer, S. S., Freeman, G., Brodsky, C., Chou, A. I., Corliss, D., Jain, S. H., Lustig, N., McGahay, V., Narasimha, S., Norum, J., Nummy, K. A., Parries, P., Sankaran, S., Sheraw, C. D., Varanasi, P. R.

Journal:

IBM Journal of Research and Development

Year:

2011

Language:

english

File:

PDF, 5.14 MB

english, 2011

4

[IEEE 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (8-12 July 2002)] Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) - Integration of copper with low-k dielectrics for 0.13 μm technology

Gambino, J., Stamper, A., McDevitt, T., McGahay, V., Luce, S., Pricer, T., Porth, B., Senowitz, C., Kontra, R., Gibson, M., Wildman, H., Piper, A., Benson, C., Standaert, T., Biolsi, P., Cooney, E.

Year:

2002

Language:

english

File:

PDF, 1013 KB

english, 2002

5

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - 65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH

McGahay, V., Bonilla, G., Chen, F., Christiansen, C., Cohen, S., Cullinan-Scholl, M., Demarest, J., Dunn, D., Engel, B., Fitzsimmons, J., Gill, J., Grunow, S., Herbst, B., Hichri, H., Ida, K., Klymko,

Year:

2006

Language:

english

File:

PDF, 496 KB

english, 2006

6

Porous Dielectrics in Microelectronic Wiring Applications

McGahay, Vincent

Journal:

Year:

2010

Language:

english

File:

PDF, 345 KB

english, 2010

7

Conformal Mapping Solution for Interdigital Comb Capacitors Between Ground Planes

McGahay, Vincent

Journal:

IEEE Electron Device Letters

Year:

2015

Language:

english

File:

PDF, 516 KB

english, 2015

8

Conductive surface oxide on CrN(001) layers

McGahay, Mary E., Gall, Daniel

Journal:

Applied Physics Letters

Year:

2019

Language:

english

File:

PDF, 1.11 MB

english, 2019

9

Phase separation of glasses

M. Tomozawa, V. McGahay, J.M. Hyde

Journal:

Journal of Non-Crystalline Solids

Year:

1990

Language:

english

File:

PDF, 827 KB

english, 1990

10

Phase separation in rare-earth-doped SiO2 glasses

Vincent McGahay, Minoru Tomozawa

Journal:

Journal of Non-Crystalline Solids

Year:

1993

Language:

english

File:

PDF, 529 KB

english, 1993

11

The effect of water on phase separation of sodium silicate glasses

Vincent McGahay, Minoru Tomozawa

Journal:

Journal of Non-Crystalline Solids

Year:

1994

Language:

english

File:

PDF, 886 KB

english, 1994

12

Inertial effects and diffusion

Vincent McGahay

Journal:

Journal of Non-Crystalline Solids

Year:

2004

Language:

english

File:

PDF, 408 KB

english, 2004

13

Correspondence of phase separation in several charged particle systems

McGahay, Vincent, Tomozawa, Minoru

Journal:

The Journal of Chemical Physics

Year:

1992

Language:

english

File:

PDF, 912 KB

english, 1992

14

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Integration of copper and fluorosilicate glass for 0.18 μm interconnections

Barth, E.P., Ivers, T.H., McLaughlin, P.S., McDonald, A., Levine, E.N., Greco, S.E., Fitzsimmons, J., Melville, I., Spooner, T., DeWan, C., Chen, X., Manger, D., Nye, H., McGahay, V., Biery, G.A., Gol

Year:

2000

Language:

english

File:

PDF, 352 KB

english, 2000

15

[IEEE 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual - San Diego, CA, USA (23-25 March 1999)] 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296) - High-current characterization of dual-damascene copper interconnects in SiO/sub 2/- and low-k interlevel dielectrics for advanced CMOS semiconductor technologies

Voldman, S., Gauthier, R., Morrisseau, K., Hargrove, M., McGahay, V., Gross, V.

Year:

1999

Language:

english

File:

PDF, 1.04 MB

english, 1999

16

[IEEE 2004 IEEE International Reliability Physics Symposium. - Phoenix, AZ, USA (25-29 April 2004)] 2004 IEEE International Reliability Physics Symposium. Proceedings - Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric

Filippi, R.G., McGrath, J.F., Shaw, T.M., Murray, C.E., Rathore, H.S., McLaughlin, P.S., McGahay, V., Nicholson, L., Wang, P.-C., Lloyd, J.R., Lane, M., Rosenberg, R., Liu, X., Wang, Y.-Y., Landers, W

Year:

2004

Language:

english

File:

PDF, 522 KB

english, 2004

17

[IEEE 1st International Symposium on Plasma Process-Induced Damage - Santa Clara, CA (13-14 May 1996)] Proceedings of 1st International Symposium on Plasma Process-Induced Damage - Process-Induced Gate Oxide Damage Issues in Advanced Plasma Chemical Vapor Deposition Processes

Cote, D., Nguyen, S., Mcgahay, V., Waskiewicz, C., Chang, S., Stamper, A., Weigand, P., Shoda, N., Matsuda, T.

Year:

1996

Language:

english

File:

PDF, 683 KB

english, 1996

18

[IEEE 2000 Symposium on VLSI Technology. Digest of Technical Papers - Honolulu, HI, USA (13-15 June 2000)] 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) - A modular 0.13 μm bulk CMOS technology for high performance and low power applications

Han, L.K., Biesemans, S., Heidenreich, J., Houlihan, K., Lin, C., McGahay, V., Schiml, T., Schmidt, A., Schroeder, U.P., Stetter, M., Wann, C., Warner, D., Mahnkopf, R., Chen, B.

Year:

2000

Language:

english

File:

PDF, 273 KB

english, 2000

19

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - BEOL Integration of Highly Damage -Resistant Porous Ultra Low-K Material Using Direct CMP and Via-first Process

Iijima, T., Lin, Q., Chen, S., Labelle, C., Fuller, N., Ponoth, S., Cohen, S., Lloyd, J., Dunn, D., Muzzy, C., Gill, J., Nitta, S., McGahay, V., Tyberg, C., Spooner, T., Nye, H.

Year:

2006

Language:

english

File:

PDF, 661 KB

english, 2006

20

[IEEE 2000 Symposium on VLSI Technology. Digest of Technical Papers - Honolulu, HI, USA (13-15 June 2000)] 2000 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.00CH37104) - A high performance 0.13 μm SOI CMOS technology with Cu interconnects and low-k BEOL dielectric

Smeys, P., McGahay, V., Yang, I., Adkisson, J., Beyer, K., Bula, O., Chen, Z., Chu, B., Culp, J., Das, S., Eckert, A., Hadel, L., Hargrove, M., Herman, J., Lin, L., Mann, R., Maciejewski, E., Narasimh

Year:

2000

Language:

english

File:

PDF, 214 KB

english, 2000

21

[IEEE 2007 IEEE Custom Integrated Circuits Conference - San Jose, CA, USA (2007.09.16-2007.09.19)] 2007 IEEE Custom Integrated Circuits Conference - Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology

Lu, Ning, Angyal, M., Matusiewicz, G., McGahay, V., Standaert, T.

Year:

2007

Language:

english

File:

PDF, 346 KB

english, 2007

22

[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections

Farooq, Mukta, Melville, Ian, Muzzy, Christopher, McLaughlin, Paul V., Hannon, Robert, Sauter, Wolfgang, Muncy, Jennifer, Questad, David, Carey, Charles, Cullinan-Scholl, Mary, McGahay, Vincent, Angya

Year:

2007

Language:

english

File:

PDF, 491 KB

english, 2007

23

[IEEE 2012 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA, USA (2012.04.15-2012.04.19)] 2012 IEEE International Reliability Physics Symposium (IRPS) - Geometry, kinetics, and short length effects of electromigration in Mn doped Cu interconnects at the 32nm technology node

Christiansen, Cathryn, Li, Baozhen, Angyal, Matthew, Kane, Terence, McGahay, Vincent, Wang, Yun Yu, Yao, Shaoning

Year:

2012

Language:

english

File:

PDF, 352 KB

english, 2012

24

[IEEE IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - Tempe, Arizon, USA (Dec. 5, 2005)] IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. - High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL

Lee, W-H., Waite, A., Nii, H., Nayfeh, H.M., McGahay, V., Nakayama, H., Fried, D., Chen, H., Black, L., Bolam, R., Cheng, J., Chidambarrao, D., Christiansen, C., Cullinan-Scholl, M., Davies, D.R., Dom

Year:

2005

Language:

english

File:

PDF, 1.04 MB

english, 2005

25

[IEEE 1st International Symposium on Plasma Process-Induced Damage - Santa Clara, CA (13-14 May 1996)] Proceedings of 1st International Symposium on Plasma Process-Induced Damage - Gate Material Dependence Of Process Charging Damage In Thin Gate Oxide

Acovic, A., Ray, A., Sun, J., Herman, J., Furukawa, T., Geiger, R., Beyer, K., McGahay, V., Greco, S., Abadeer, W.

Year:

1996

Language:

english

File:

PDF, 415 KB

english, 1996

26

[IEEE 2011 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2011.04.10-2011.04.14)] 2011 International Reliability Physics Symposium - Electromigration-resistance enhancement with CoWP or CuMn for advanced Cu interconnects

Christiansen, Cathryn, Li, Baozhen, Angyal, Matthew, Kane, Terence, McGahay, Vincent, Wang, Yun Yu, Yao, Shaoning

Year:

2011

Language:

english

File:

PDF, 747 KB

english, 2011

27

[IEEE International Electron Devices Meeting. Technical Digest - San Francisco, CA, USA (8-11 Dec. 1996)] International Electron Devices Meeting. Technical Digest - A high-density 6.9 sq. μm embedded SRAM cell in a high-performance 0.25 μm-generation CMOS logic technology

Subbanna, S., Agnello, P., Crabbe, E., Schulz, R., Wu, S., Tallman, K., Saccamango, M.J., Greco, S., McGahay, V., Allen, A.J., Chen, B., Cotler, T., Eld, E., Lasky, J., Ng, H., Ray, A., Snare, J., Su,

Year:

1996

Language:

english

File:

PDF, 352 KB

english, 1996

28

32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed

Yao, Shaoning, McGahay, Vincent, Angyal, Matthew S., Simon, Andrew H., Lee, Tom C., Christiansen, Cathryn, Li, Baozhen, Chen, Fen, McLaughlin, Paul S., Ogunsola, Oluwafemi O., Grunow, Stephan

Journal:

MRS Proceedings

Year:

2011

Language:

english

File:

PDF, 296 KB

english, 2011

29

Optimization of AICu Wiring Delay in Advanced CMOS Technology

Stamper, A. K., McGahay, V., Shapiro, M., Miller, L. A., Tian, X., Bryant, A., Serianni, L. A.

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 366 KB

english, 1996

30

Growth and properties of epitaxial Ti 1− x Mg x N(001) layers

Wang, Baiwei, Kerdsongpanya, Sit, McGahay, Mary E., Milosevic, Erik, Patsalas, Panos, Gall, Daniel

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2018

Language:

english

File:

PDF, 1.16 MB

english, 2018

31

Resistivity scaling and electron surface scattering in epitaxial Co(0001) layers

Milosevic, Erik, Kerdsongpanya, Sit, McGahay, Mary E., Zangiabadi, Amirali, Barmak, Katayun, Gall, Daniel

Journal:

Journal of Applied Physics

Year:

2019

File:

PDF, 1.07 MB

2019

32

The Resistivity Size Effect in Epitaxial Nb(001) and Nb(011) Layers

Milosevic, Erik, Kerdsongpanya, Sit, McGahay, Mary E., Wang, Baiwei, Gall, Daniel

Journal:

IEEE Transactions on Electron Devices

Year:

2019

File:

PDF, 718 KB

2019

33

Band gap and electron transport in epitaxial cubic

McGahay, Mary E., Wang, Baiwei, Shi, Jian, Gall, Daniel

Journal:

Physical Review B

Year:

2020

File:

PDF, 1.28 MB

2020

34

(001)

McGahay, Mary E., Khare, Sanjay V., Gall, Daniel

Journal:

Physical Review B

Year:

2020

File:

PDF, 1.35 MB

2020